Electronic instrument housing



FIG. 1 is a front elevational view of an electronic instrument housing showing my new design, the rear elevational view being identical;

FIG. 2 is a top plan view thereof;

FIG. 3 is a right side elevational view thereof, the left side elevational view being identical;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a cross-sectional view in elevational taken along the line 5--5 of FIG. 2;

FIG. 6 is a front elevational view of a second embodiment of my electronic instrument housing similar to FIG. 1 with the right side elevational view and the bottom view being the same as in FIGS. 3 and 4 except for the proportions thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a front elevational view of a third embodiment of my electronic instrument housing of this invention similar to FIG. 1 with the side elevational view and the bottom view being the same as FIGS. 3 and 4, except for the proportions thereof;

FIG. 9 is a top plan view thereof;

FIG. 10 is a front elevational view of a fourth embodiment of my form of electronic instrument housing in accordance with this invention similar to FIG. 1 wherein the front panel shows a reveal around its edge, all other figures corresponding to FIGS. 2-4 thereof; and,

FIG. 11 is a partial cross-sectional view in elevation taken along the line 11--11 of FIG. 10 to show the front panel reveal thereof. 

The ornamental design for an electronic instrument housing, as shown and described. 